Developed by Villo, the VS-AOC-01 OHB Automatic Dust Removal System is designed for the high cleanliness requirements of semiconductor wafer manufacturing and automated material handling.
Its non-contact cleaning technology and multi-axis coordination enable precise removal of fine particles while helping reduce secondary contamination risks.
| Item | Specification |
| Model | VS-AOC-01 |
| Dimensions (W × D × H) | 388 × 353 × 337 mm |
| Dust Removal Performance (Remaining Particle Count After Cleaning) | ≤ 20 particles/cm² (0.3 μm) |
| Cleaning Area | OHB Surface |
| Weight (kg) | ≤ 11 |
| Maximum Power (W) | 700 |
| Cleaning Capacity per Full Charge | 15–20 cleaning cycles |
| Noise Level (dB) | ≤ 80 |
| Filtration Grade | U15 |
| Material | Aluminum Alloy, PEEK, etc. |
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